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CHIP 200W TERMINATIONS
9.4x9.4x1.52mm,200w,chips
¡ñ unleaded technics, accord with Standard Rohs
¡ñ the Substrate Material uses environmental aluminum nitride ceramics
¡ñ the resistive film adopts the high performance thin film technology
¡ñ use the newest processing technology enhance the pad strength

This chip adopts the advanced process technique like film technique, Laser Trimming technology, and Medium & High Power dissipation, etc. which can absolutely satisfy the application requirement of nowadays Communication System like CDMA and WCDMA, ect.

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NO. POWER SUBSTRATE DIMETION FREQENCYRANGE VSWR INTERFAC ATTEN
MANC9494T050G 200W ALN 9.4x9.4x1.52mm DC-3.0GHz <1.2:1 CHIP -
   
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