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| Power Divider, Coupler, Isolator,etc. |
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20W,4.0x4.0mm Aluminum nitride substrate |
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4.0x4.0mm Aluminum nitride substrateŁ¬20w, plate, lead, flange |
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ˇń the Substrate Material uses environmental aluminum nitride ceramics
ˇń the resistive film adopts the high performance thin film technology
ˇńuse the newest processing technology enhance the pad strength
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The load products can provide a certain high power dissipation through Thermal Dissipation, which are especially applicable for splitters, couplers, isolators and so on.
Designed and made with film and Laser Trimming Resistance Technology, this product has a good RF power performance, which can cater for the application requirements of fully meeting the current CDMA and WCDMA communications systems.
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Element Tables /
Product Support and Service |
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Product
Specifications: |
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| NO. |
POWER |
SUBSTRATE |
DIMETION |
FREQENCYRANGE |
VSWR |
INTERFAC |
ATTEN |
| MANC160160T050G |
20W |
aluminum nitride |
4.0x4.0mm |
DC-3GHz |
<1.15:1 |
plate, lead, flange |
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